Electrostatic Discharge Packaging Market Regional Analysis:
Asia Pacific Market Insights
Asia Pacific in ESD Packaging market is estimated to hold over 48.4% revenue share by the end of 2035, due to the growing electronics manufacturing industry. The region’s high mobile phone usage and rising investment in technology infrastructure are other factors driving the electrostatic discharge (ESD) packaging market. As per the report, the number of mobile internet users in APAC is projected to increase from 1.4 billion in 2022 to 1.8 billion in 2030 due to increased consumer demand for electronic gadgets. This surge creates the demand for ESD packaging to safeguard delicate parts from destruction in the manufacturing and shipping stages.
The electronics industry in India is growing at a rapid pace due to government policies that have encouraged the manufacturing of electronic products in the country. In 2022, the sector was valued at approximately USD 3.6 billion, with further expansion driven by the Production Linked Incentive (PLI) scheme. The government of India has also planned to provide INR 40,951 crore (USD 5.5 billion) to encourage the large-scale manufacturing of electronics during the next five years. This initiative increases ESD packaging demand because local manufacturers increase the production of consumer electronics as well as semiconductors.
China is also anticipated to garner considerable demand for ESD packaging during the forecast period. Furthermore, the country’s dominance in the consumer electronics market is bolstered by strong innovation and manufacturing capacity. The Ministry of Industry and Information Technology reported that in 2022, China remained the largest consumer electronics manufacturer in the world, with constantly increasing export and domestic consumption. This dominance underlines the importance of ESD packaging in protecting the components that are highly sensitive to anti-static shocks during mass production as well as international transportation.
North America Market Insights
North America region is anticipated to observe substantial growth through 2035, owing to the growth of electronics and semiconductor industries in the region. The IoT, 5G, and electric vehicle applications push the necessity of ESD packaging for sensitive components during production and logistics. This drives the market growth as the region has a stronger emphasis on research and development of packaging solutions.
The U.S. is one of the significant ESD packaging markets due to the increase in semiconductor and consumer electronics industries. Given that the CHIPS Act promotes the production of semiconductors locally, then the need for ESD packaging is anticipated to increase. The U.S. Department of Commerce in March 2024 unveiled that USD 39 billion will be spent on the improvement of chip manufacturing, hence underlining the importance of reliable ESD protective supplies. This initiative mitigates the inherent risks that are inclined to affect sensitive electronic components crucial for the nation’s technological and manufacturing development.
In Canada, the demand from the electronics industry, such as automotive and telecommunications among others, has been a primary driver of ESD packaging market expansion. The government of Canada investment in technology infrastructure is improving the capacity of domestic production. In 2023, the Canadian ISED provided USD 250 million to boost the production of electronic components. This funding enhances the country’s standing in ESD packaging, thus protecting key components during shipping and construction.
