Electrostatic Discharge (ESD) Packaging Market Size & Share, by Material Type (Conductive Plastics, Metal, Static Dissipative Plastics, Polyethylene, Polypropylene, Polyvinyl Chloride); Product Type (Bags & Pouches, Trays, Boxes & Containers, Tapes & Labels, Foams); Packaging Type (Chipboard Boxes, Corrugated Boxes, Tote Boxes, Tubes and Clamshells) - Global Supply & Demand Analysis, Growth Forecasts, Statistics Report 2024-2036

  • Report ID: 6157
  • Published Date: Jun 12, 2024
  • Report Format: PDF, PPT

Global Market Size, Forecast, and Trend Highlights Over 2024-2036

Electrostatic Discharge Packaging Market size was valued at USD 2 Billion in 2023 and is predicted to cross USD 5.3 Billion by the end of 2036, expanding at more than 6% CAGR during the forecast period i.e., between 2024-2036. In the year 2024, the industry size of electrostatic discharge packaging is assessed at USD 2.12 Billion.

The ESD packaging market is anticipated to expand significantly as a result of technological advancements since more electronic components and gadgets are becoming vulnerable to electrostatic discharge. According to the International Energy Agency, with an average of more than 1.3 televisions in every home with access to power, there are currently close to 2 billion televisions in use. More than half of the world's population has a mobile phone subscription, and there are already more than 5.5 billion external power supplies connected to various electronic gadgets. Therefore, the growing use of electronic gadgets is driving the growth of the electrostatic discharge (ESD) packaging market.


Electrostatic Discharge Packaging Market Overview
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Electrostatic Discharge Packaging Sector: Growth Drivers and Challenges

Growth Drivers

  • Growing demand in electronics industry - The majority of electrical goods usually sustain damage as a result of static electricity buildup. The electrostatic discharge packaging market is further driven by the growing use of ESD packaging for ESD-prone components in the electrical and electronics industry, a trend that is anticipated to persist throughout the forecast period.

    For instance, the line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics, and other sensitive electronic components has been expanded by Cleanroom Film and Bags (CFB), a division of C-P Flexible Packaging.
     
  • Growing adoption in printed circuit boards - Electrostatic discharge has the ability to ruin any printed circuit board. The electrostatic discharge (ESD) packaging market is anticipated to be driven throughout the projected period by the growing usage of these packages by different end-use industries.

    Additionally, the product is shielded from gasses and combustible materials by the ESD packing. These types of packaging materials are designed to encourage the straight flow of electricity without endangering the goods that are within. Since ESD packaging provides greater safety than conventional packaging techniques, the market is anticipated to grow throughout the projected period.
     
  • Surge in the demand for biodegradable ESD packages - It is anticipated that the worldwide ESD packaging market will see more investment possibilities as a result of most companies' increased efforts in biodegradable packages. Although biodegradable packaging is less expensive and weighs less, it will take some time for the electrostatic discharge packaging market to accept these relatively new and experimental products.

    Also, the growing plastic pollution is one of the major elements that will increase the demand for biodegradable packaging. According to the National Institutes of Health, plastic manufacturing has grown from 2.3 million tons in 1950 to over 450 million tons in 2015, and by 2050, it is predicted to have doubled.

Challenges

  • High raw material prices - To satisfy strict criteria, ESD packaging solutions may call for specialized materials and production techniques. These materials' and processes' costs might be problematic, particularly for businesses where costs are a factor. There is a dearth of standardized ESD packaging solutions since different sectors have different requirements for ESD protection.
     
  • Compatibility issues with ESD packaging - When components from several manufacturers must be packaged together, compatibility problems may occur. Although shielding sensitive devices with ESD packaging is crucial, eco-friendly and sustainable procedures are becoming more and more important. As a result, the hazards and expensive cost of electrostatic discharge packaging may reduce acceptance rates, which would further impede electrostatic discharge packaging market expansion.

Electrostatic Discharge Packaging Market: Key Insights

Base Year

2023

Forecast Year

2024-2036

CAGR

6%

Base Year Market Size (2023)

USD 2 Billion

Forecast Year Market Size (2036)

USD 5.3 Billion

Regional Scope

  • North America (U.S., and Canada)
  • Latin America (Mexico, Argentina, Rest of Latin America)
  • Asia-Pacific (Japan, China, India, Indonesia, Malaysia, Australia, Rest of Asia-Pacific)
  • Europe (U.K., Germany, France, Italy, Spain, Russia, NORDIC, Rest of Europe)
  • Middle East and Africa (Israel, GCC North Africa, South Africa, Rest of the Middle East and Africa)
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Electrostatic Discharge Packaging Segmentation

 Material Type (Conductive Plastics, Metal, Static Dissipative Plastics, Polyethylene (PE), Polypropylene (PP), Polyvinyl Chloride (PVC))

Conductive plastics segment in the electrostatic discharge packaging market is poised to reach USD 620 Million by 2036. The segment growth can be credited to the growing usage of ESD packaging in the electronic industry. Electrostatic discharge is effectively dissipated by conductive plastics and coatings, which provide a direct conductive channel for static charges.

These materials provide consistent ESD protection because of their predicted surface resistance level. Sensitive electronic components can be shielded from external ESD threats with exceptional ESD shielding efficacy from metal foil and metalized films.

Packaging Type (Chipboard Boxes, Corrugated Boxes, Tote Boxes, Tubes and Clamshells)

Chipboard boxes segment in the electrostatic discharge packaging market is set to register more than 5.3% growth from 2024 to 2036. The segment growth can be attributed to the growing demand for cost-effective packaging. According to the World Packaging Organization, the cost of packaging accounts for 48 cents of every dollar (48%) spent on Coke's products. Primary containers and flexible packaging, or the wrappers and containers that provide instant protection to the packaged product, account for 60% of the market. Because they are affordable and lightweight, chipboard boxes are perfect for shipping and storing tiny, light-weight electronic components. Their little weight makes them appropriate for sectors that need economical packaging solutions and lowers shipping expenses.

End-use (Electronics and Semiconductors, Automotive, Aerospace and Defense, Healthcare, Industrial Machinery, Consumer Goods)

Electronics & semiconductors segment is predicted to hold ESD packaging market  share of more than 32% by 2036. The segment growth is impelled by the growing use of ESD packaging in the electronic industry to protect the components from electrostatic damage. The electronics manufacturing industry deals with a wide range of ESD-sensitive components, such as integrated circuits, microprocessors, and printed circuit boards. ESD packaging is crucial to protect these components during assembly, testing, and transportation.

Our in-depth analysis of the global market includes the following segments:

            Material Type

  • Conductive Plastics
  • Metal
  • Static Dissipative Plastics
  • Polyethylene (PE)
  • Polypropylene (PP)
  • Polyvinyl Chloride (PVC)

            Product Type

  • Bags and Pouches
  • Trays
  • Boxes and Containers
  • Tapes and Labels
  • Foams

            Packaging Type

  • Chipboard Boxes
  • Corrugated Boxes
  • Tote Boxes
  • Tubes and Clamshells

            ESD Classification

  • Anti-Static
  • Static Dissipative
  • Conductive

            Application

  • Integrated Circuits
  • Printed Circuit Boards (PCBs)
  • Electronic Components
  • Medical Devices
  • Automotive Parts
  • Aerospace Components
  • Chemicals and Explosives

            End-use

  • Electronics and Semiconductors
  • Automotive
  • Aerospace and Defense
  • Healthcare
  • Industrial Machinery
  • Consumer Goods 

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Electrostatic Discharge Packaging Industry - Regional Synopsis

North America Market Statistics

Electrostatic discharge packaging market size for North America region is expected to reach USD 560 Million by 2036. The market growth in the region is also expected on account of the increased need for transportation and customized packaging of these gadgets to prevent damage as a result of the manufacturing and automotive industries' expanding usage of technological equipment.

 Electrostatic discharge packaging is seeing rapid growth in the market due to the United States's robust electronics manufacturing sector, which creates a wide range of electric devices and components. According to the US Environmental Protection Agency, 12% of household power use in the United States is attributed to the twenty-four consumer electronics that the average household possesses.

To take advantage of new opportunities and adapt to changing client expectations, major businesses in Canada are concentrating on product innovation, sustainability, and customer-centric solutions. Additionally, the need for high-quality ESD packaging solutions to protect delicate components from electrostatic harm is driven by the emphasis on product quality, reliability, and performance in crucial applications, such as aerospace, defense, medical devices, and automotive electronics.

APAC Market Analysis

The APAC region will also encounter huge growth for the electrostatic discharge packaging market during the forecast period and will hold the second position owing to the increased proliferation of smartphones, tablets, wearables, and IoT devices is propelling the demand for ESD packaging. According to the Asia Development Bank, Asia Pacific saw average annual growth rates of 10.1% and 8.0% for exports and imports of digitally deliverable services during that time, compared to a global average of 6.9% for exports and 6.7% for imports.

China's electrostatic discharge (ESD) packaging market is expanding due to the country's strong presence of top manufacturers, increased exports of electronic gadgets, and quickening pace of electronics production and sales. Similar to this, it is anticipated that China's growing information and communication technology goods sector will increase demand for electrostatic discharge (ESD) packaging. According to UNCTAD, China is the world's top exporter of ICT goods, making up nearly 30% of all exports, as is usual for such commodities.

The key reasons propelling the electrostatic discharge packaging market in Japan include the rapidly growing packaging industry, the rising use of electronic devices in a variety of industries, and the increased emphasis on safeguarding delicate electronics during transit. Likewise, during the projection period, the nation's growing military spending and expenses will drive up demand for electrostatic discharge packaging solutions.

Research Nester
Electrostatic Discharge Packaging Market Share
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Companies Dominating the Electrostatic Discharge Packaging Landscape

    These companies concentrate on forming strategic alliances, introducing new products, and commercializing them to grow their markets. These companies are also making significant investments in research, which enables them to launch cutting-edge goods and maximize market share.

    • Sealed Air Corporation
      • Company Overview
      • Business Strategy
      • Key Product Offerings
      • Financial Performance
      • Key Performance Indicators
      • Risk Analysis
      • Recent Development
      • Regional Presence
      • SWOT Analysis
    • Desco Industries Inc.
    • Pall Corporation
    • Teknis Limited
    • RS Technologies, LLC
    • Statclean Technology (M) Sdn Bhd
    • Cortec Corporation
    • Protective Packaging Corporation
    • Dou Yee Enterprises (S) Pte Ltd
    • Tek Pak, Inc.

In the News

  • Cortec® Corporation has advanced its newest generation of dual ESD/corrosion inhibiting films and bags with the introduction of EcoSonic® VpCI®-125 HP Permanent ESD Film & Bags. Although not a new concept for Cortec®, the idea of combining ESD protection with corrosion inhibition for electronics packaging is novel and interesting to ESD experts who learn of it. This film not only provides long-term static dissipation, but it also fills the package with vapor phase corrosion inhibitors, which form a protective molecular coating over the bag's multi-metal components. When the electronics are removed, they can be installed right away.
     
  • Freudenberg Performance Materials, based in Germany, is expanding the selection of technical packaging textiles it offers. Electrostatic discharge is prevented in industrial and automotive parts with electronic components by the new Evolon ESD collection. This applies to steering wheels, mirrors, dashboards, trim lines, and so on. Additionally, Evolon ESD keeps delicate surfaces from being scratched

Author Credits:  Abhishek Anil


  • Report ID: 6157
  • Published Date: Jun 12, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2023, the industry size of electrostatic discharge packaging was over USD 2 billion.

The market size for electrostatic discharge packaging is projected to cross USD 5.3 billion by the end of 2036 expanding at a CAGR of 6% during the forecast period i.e., between 2024-2036.

The major players in the market are Sealed Air Corporation, Desco Indutries Inc., Pall Corporation, Teknis Limited, RS Technologies, LLC, Statclean Technology (M) Sdn Bhd, Cortec Corporation, Protective Packaging Corporation, Dou Yee Enterprises (S) Pte Ltd, Tek Pak, Inc., and others.

The conductive plastics segment is anticipated to garner a size of 620 million during 2024-2036.

The North America electrostatic discharge packaging sector is poised to generate a revenue of 560 million by the end of 2036.
Electrostatic Discharge Packaging Market Report Scope
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