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Global Electrostatic Discharge (ESD) Packaging Market
ESD Packaging Market size was valued at USD 2.4 billion in 2024 and is projected to reach a valuation of USD 5.9 billion by the end of 2037, rising at a CAGR of 7% during the forecast period, i.e., 2025-2037. In 2025, the industry size of electrostatic discharge (ESD) packaging is evaluated at USD 2.6 billion.
The electrostatic discharge (ESD) packaging market is on the rise due to the increased use of better protection methods in electronics, semiconductors, and the automotive industry. Since complex electronic devices and components have become more and more sensitive, the protection of ESD packaging, which avoids the effect of static electricity has become essential. In July 2024, Daubert Cromwell launched VCI/ESD poly film and bags that combine the corrosion protection feature with the static shield. This two-in-one packaging satisfies the new electrostatic discharge packaging market requirements and is indicative of a shift toward multiple-layer protection solutions in electronics production and distribution.
Increased government support to improve electronics manufacturing and increase semiconductor production also promotes the ESD packaging market. The U.S. CHIPS and Science Act and similar initiatives in Asia Pacific and Europe create demand for semiconductor fabrication, which increases the need for ESD-safe materials. In November 2024, EcoCortec introduced EcoSonic VpCI-125 PCR HP Films and Bags, which are aligned with sustainability including the use of 30% post-consumer recycled material. This innovation is inline with sustainable development goals and government policies on green packaging solutions to support ESD packaging to advocate for sustainable supply chains.
Growth Drivers
Challenges
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Base Year |
2024 |
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Forecast Year |
2025-2037 |
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CAGR |
7% |
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Base Year Market Size (2024) |
USD 2.4 billion |
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Forecast Year Market Size (2037) |
USD 5.9 billion |
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Regional Scope |
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Material Type (Conductive Materials, Anti-static Materials, Static Shielding Materials, Composite Materials, Others)
Conductive materials segment is poised to account for ESD packaging market share of around 36.4% by 2037. The segment is observing rapid growth as the materials are very useful in protecting electronics from the accumulation of static charges and our ability to protect parts throughout transit and storage. In July 2024, Daubert Cromwell’s VCI/ESD poly film and bags established a new level of conductive material through the integration of corrosion inhibitors and ESD features. Furthermore, the segment’s growth is driven by the rising manufacture of semiconductors as well as the broadening usage in industries that need the protection of sensitive components.
Application (Electronics Manufacturing, Automotive, Aerospace, Medical Devices, Telecommunications, Consumer Goods, Semiconductor Industry, Others)
In ESD packaging market, electronics manufacturing segment is estimated to capture revenue share of over 44.7% by 2037. As consumer electronics, telecommunications, and IoT devices become more popular, it becomes necessary to protect fragile components. In June 2024, Siemens launched new ESD verification tools targeting semiconductor manufacturing that prove that static control is crucial in electronics. The electronics segment continues to grow at a significant pace due to increased digitalization and connectivity, dominating the ESD packaging market.
Our in-depth analysis of the global market includes the following segments:
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Product Type |
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Material Type |
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Application |
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Asia Pacific Market Statistics
Asia Pacific in ESD Packaging market is estimated to hold over 48.4% revenue share by the end of 2037, due to the growing electronics manufacturing industry. The region’s high mobile phone usage and rising investment in technology infrastructure are other factors driving the electrostatic discharge (ESD) packaging market. As per the report, the number of mobile internet users in APAC is projected to increase from 1.4 billion in 2022 to 1.8 billion in 2030 due to increased consumer demand for electronic gadgets. This surge creates the demand for ESD packaging to safeguard delicate parts from destruction in the manufacturing and shipping stages.
The electronics industry in India is growing at a rapid pace due to government policies that have encouraged the manufacturing of electronic products in the country. In 2022, the sector was valued at approximately USD 3.6 billion, with further expansion driven by the Production Linked Incentive (PLI) scheme. The government of India has also planned to provide INR 40,951 crore (USD 5.5 billion) to encourage the large-scale manufacturing of electronics during the next five years. This initiative increases ESD packaging demand because local manufacturers increase the production of consumer electronics as well as semiconductors.
China is also anticipated to garner considerable demand for ESD packaging during the forecast period. Furthermore, the country’s dominance in the consumer electronics market is bolstered by strong innovation and manufacturing capacity. The Ministry of Industry and Information Technology reported that in 2022, China remained the largest consumer electronics manufacturer in the world, with constantly increasing export and domestic consumption. This dominance underlines the importance of ESD packaging in protecting the components that are highly sensitive to anti-static shocks during mass production as well as international transportation.
North America Market Analysis
North America ESD Packaging market is poised to register growth of around 7% till 2037, owing to the growth of electronics and semiconductor industries in the region. The IoT, 5G, and electric vehicle applications push the necessity of ESD packaging for sensitive components during production and logistics. This drives the market growth as the region has a stronger emphasis on research and development of packaging solutions.
The U.S. is one of the significant ESD packaging markets due to the increase in semiconductor and consumer electronics industries. Given that the CHIPS Act promotes the production of semiconductors locally, then the need for ESD packaging is anticipated to increase. The U.S. Department of Commerce in March 2024 unveiled that USD 39 billion will be spent on the improvement of chip manufacturing, hence underlining the importance of reliable ESD protective supplies. This initiative mitigates the inherent risks that are inclined to affect sensitive electronic components crucial for the nation’s technological and manufacturing development.
In Canada, the demand from the electronics industry, such as automotive and telecommunications among others, has been a primary driver of ESD packaging market expansion. The government of Canada investment in technology infrastructure is improving the capacity of domestic production. In 2023, the Canadian ISED provided USD 250 million to boost the production of electronic components. This funding enhances the country’s standing in ESD packaging, thus protecting key components during shipping and construction.
The electrostatic discharge (ESD) packaging market is highly fragmented with industry giants including Antistat Inc., Desco Industries, NEFAB GROUP, Sealed Air Corporation, and GWP Conductive that continually invest in innovation and expansion. These companies are increasing production and diversifying their product offerings as global demand for electronics increases and protection needs for sensitive components change. In November 2023, Conductive Containers, Inc. (CCI) acquired Crestline Plastics to expand the range of static control packaging solutions offered and strengthen its position in the electrostatic discharge packaging market. This case is an example of a strategic merger and acquisition that has become common among organizations as they try to develop new capacities and reach new markets.
Businesses incorporating recyclable material, multi-layered packaging, and environmentally friendly static control solutions in their production line should be in a good position to exploit the changing ESD packaging market trends. With the increasing threats of ESD as associated with IoT, 5G, and electric vehicles, the need for creativity in dual-form and high-strength packaging is becoming paramount, enhancing the importance of ESD packaging in defending the electronic environment.
Here are some leading companies in the electrostatic discharge (ESD) packaging market:
Author Credits: Abhishek Verma
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