Through-hole Passive Components Market Players:
- TT Electronics PLC
- Company Overview
- Business Strategy
- Key Product Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- Bourns, Inc.
- CORNELL DUBILIER AND CORNELL DUBILIER MARKETING, INC.
- TDK Electronics AG
- SAMSUNG ELECTRO-MECHANICS
- TAIYO YUDEN CO., LTD.
- Walsin Technology Corporation
- Yageo Corporation
- KEMET Corporation.
- KYOCERA AVX Components Corporation
- TDK Corporation.
- Vishay Intertechnology, Inc.
- Nippon Chemi-Con Corporation.
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
In the year 2026, the industry size of through-hole passive components is assessed at USD 45.06 billion.
The global through-hole passive components market size was valued at more than USD 42.21 billion in 2025 and is expected to register a CAGR of over 7.5%, exceeding USD 87 billion revenue by 2035.
The Asia Pacific region is anticipated to hold a 44% share by 2035 in the through-hole passive components market, attributed to growing implementation of modules across automotive, consumer electronics, and industrial applications.
Key players in the market include TT Electronics PLC, Bourns, Inc., TDK Electronics AG, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD., Walsin Technology Corporation, Yageo Corporation, KEMET Corporation, Vishay Intertechnology, Inc., Nippon Chemi-Con Corporation.
