Thermal Interface Materials Market - Regional Analysis
APAC Market Insights
Asia Pacific in the thermal interface materials market is expected to capture the largest share of 45.2% by the end of 2035. The region’s leadership is efficiently propelled by the presence of key manufacturers and reduced corporate taxes. The increasing disposable income, coupled with suitable government policies, is also positively influencing regional market progression. In September 2025, U-MAP Co., Ltd. announced that it had launched thermalnite, which is a proprietary fibrous aluminum nitride filler for advanced thermal interface materials. Besides, thermalnite delivers high thermal conductivity (10–14 W/m·K) and enhanced mechanical strength even at low filler loading, thereby overcoming traditional TIM challenges such as brittleness and interfacial resistance. Further, the company currently offers end-to-end development support, from feasibility testing to mass production, targeting EVs, power devices, and 5G/6G communication modules.
China is augmenting its leadership in the regional landscape of the thermal interface materials market, facilitated by its massive electronics production and expansion in EV manufacturing. The country is witnessing a huge need for effective thermal management in high-density processors, GPUs, and power modules, which in turn is encouraging domestic companies to develop innovative materials with superior thermal conductivity. Indium Corporation announced that it will present on next-generation pattern X, which is a compressible metal thermal interface material, at TestConX China in November 2025. The TIM, made of pure indium, delivers excellent thermal transfer with low contact pressure and is especially designed for warped or non-planar surfaces, addressing common polymer-based TIM failures. Furthermore, this innovation is focused on high-performance computing, automotive electronics, and power semiconductor applications, thereby highlighting Indium Corporation’s predominant position in thermal management solutions globally.
India is efficiently growing in the thermal interface materials market, primarily fueled by its emerging electronics sector, expanding EV industry, and government-backed initiatives for smart infrastructure and renewable energy. Besides, thermal interface materials are being extensively utilized in the country in terms of power electronics, telecom equipment, and industrial automation applications to ensure high-end performance. In this context, Kivoro, in October 2022, announced that it has partnered with Graphite India Limited to distribute its next-generation graphene-based heat transfer additives across the country, targeting the corrugated paperboard industry. In addition, the collaboration mainly aims to enhance thermal performance, reduce energy consumption, and improve production efficiency in the manufacturing plants of India. Furthermore, the firm’s strong domestic presence and technical expertise support the adoption of advanced thermal solutions by promoting sustainability and industrial modernization.
North America Market Insights
North America is representing notable growth in the thermal interface materials market due to the strong adoption of high-performance computing, cloud data centers, and advanced semiconductor manufacturing. Simultaneously, the region is witnessing increasing focus on EVs, aerospace electronics, and industrial automation, which in turn is fueling the demand for high-efficiency TIM solutions. YINCAE, in August 2025, announced that it had launched next-generation liquid metal thermal interface material TM 150LM, which is especially engineered for enhanced viscosity to provide superior printability and long-term reliability. The firm also notes that, unlike conventional TIMs, this TM 150LM maintains high viscosity at both room and elevated temperatures, thereby enabling very precise stencil printing by efficiently reducing common issues such as pump-out and bleed. Furthermore, this innovation delivers proper thermal conductivity for high-power CPUs, GPUs, and power modules, ensuring improved interface integrity under harsh thermal conditions.
In the U.S., the thermal interface materials market is growing due to the booming data center and AI infrastructure, as well as the widespread deployment of consumer electronics. Simultaneously, the government initiatives that are promoting renewable energy and electric mobility have spurred investments in efficient thermal management systems, particularly in EV battery modules and power electronics, enhancing the market’s significance. In September 2022, Henkel announced that it had completed the acquisition of Nanoramic Laboratories’ thermal management materials business, Thermexit, with a prime focus on strengthening the adhesive technologies unit. Besides. Thermexit’s patented nano-filler technology offers high-performance thermal interface gap pads with exceptional thermal conductivity and stability, targeting fast-growing sectors such as 5G, semiconductors, and automotive electronics.
Canada has gained exceptional exposure in the thermal interface materials market owing to the expanding high-tech manufacturing sector and heightened demand for reliable thermal management in semiconductor fabs and computing hardware. Simultaneously, the country’s market benefits from a strong focus on research and development in electronics and nanotechnology that has fueled the adoption of advanced thermal solutions. Increasing investments in data centers and electric vehicle production are driving heightened demand for efficient heat dissipation materials. In addition, manufacturers in the country are collaborating with global tech firms to innovate high-performance thermal interface products. Furthermore, government incentives supporting clean energy and sustainable electronics are also boosting thermal interface materials market growth in the country.
Europe Market Insights
Europe in the thermal interface materials market represents encouraging opportunities for both national and international players. A focus on automotive electrification, industrial automation, and energy-efficient electronics is the key factor solidifying the region’s prominence in this field. In addition, research-intensive areas in Germany, the UK, and Nordic countries are leading in terms of the development of high-performance materials for EV batteries, renewable energy systems, and high-speed computing applications. In September 2021, DuPont announced that its BETATECH thermal interface material had been selected by Renault for use in its Maubeuge and Douai EV production plants to manage heat from high-energy-density batteries during charging and operation. It also stated that the TIM ensures consistent thermal conductivity, gap-free contact between battery cells and cooling plates, and supports fast, repeatable assembly in high-volume production, hence contributing to overall market growth.
Germany is considered to be the frontrunner in the regional thermal interface materials market, in which the demand is driven by the automotive sector’s shift to electric mobility and advanced industrial machinery. Domestic manufacturers in the country are emphasizing sustainable and high-performance thermal solutions to meet stringent quality standards in both consumer and industrial electronics. In this context, Parker Chomerics in October 2024 reported that it introduced a wide range of thermal interface materials at Electronica 2024 in Munich, which includes the THERM-A-FORM CIP 60 cure-in-place material, THERM-A-GAP 80LO thermal gap pad, and THERM-GAP GEL 75VT dispensable thermal gel, which are efficiently designed for applications in automotive, e-mobility, telecommunications, and industrial electronics. It also stated that these materials address key industry challenges, such as oil bleed, vertical tackiness, and gap-filling efficiency, by offering thermal conductivity under stress and vibration, hence attracting more players to make investments in this field.
In the U.K., the thermal interface materials market is supported by a rise in data centers, defense electronics, and smart infrastructure projects. Simultaneously, the increasing adoption of computing devices is also driving investment in advanced thermal management materials, thereby promoting innovation and collaboration between industry and research institutions. Parker Chomerics, in May 2025, released its updated thermal interface materials catalogue by covering its complete range of electronics cooling solutions, which includes gap fillers, phase-change materials, thermal tapes, and thermal greases. Besides, the catalogue provides detailed product information, application guidance, and a new dispensing guide to ensure consistent and effective use in electronic devices across telecommunications, IT, automotive, medical, and defence sectors. Furthermore, it also highlights heat spreaders, dielectric pads, and underfill materials, thereby helping engineers optimize thermal management in modern electronic assemblies.
