Thermal Interface Materials Market Analysis

Product Type Segment Analysis

The greases & adhesives will lead the product type segment, capturing the largest revenue share of 44.3% in the thermal interface materials market over the forecasted years. They provide excellent gap-filling and thermal conductivity, which is highly essential for high-power processors, GPUs, and dense electronics. Also, their high performance under thermal cycling drives widespread adoption in consumer and industrial electronics.  Henkel, in May 2023, announced that it launched the Loctite TLB 9300 APSi, which marks a first-of-its-kind injectable thermally conductive adhesive for electric vehicle battery systems which is offering both structural bonding and thermal interface functionality between battery cells and cooling systems. The firm underscores that this two-component polyurethane adhesive allows high thermal conductivity, electrical insulation, and self-leveling properties, thereby enabling safer EV batteries. Furthermore, Henkel emphasizes stronger collaborations with OEMs and battery manufacturers to address e-mobility challenges and advance zero-emission vehicle technologies.

Application Segment Analysis

In the application segment, computers will capture a considerable revenue share in the thermal interface materials market by the end of 2035. Rising demand for high-performance PCs, servers, and GPUs generates heat that requires efficient thermal management, positioning the subtype as a gold standard for revenue generation in this field. Besides, the adoption of AI workloads and machine learning accelerators is intensifying thermal challenges, necessitating advanced TIMs with ultra-low thermal resistance. Data center expansions in hyperscale cloud environments will drive huge deployment of TIM solutions between processors and heat sinks. In addition, next-generation gaming rigs and workstation PCs with multi-GPU setups will rely on high-performance thermal greases to maintain sustained performance. Furthermore, the emerging compact modular PCs and edge computing devices will push demand for TIMs that perform reliably in confined architectures.

Material Type Segment Analysis

In the thermal interface materials market, silicone-based TIMS will grow with a significant revenue stake over the discussed timeframe. The growth of the segment is subject to the high thermal conductivity and reliability across consumer electronics, semiconductors, and power devices. In this context, KCC Silicone in July 2025 reported that it participated in Hyundai MOBIS Tech Day, showcasing 18 silicone solutions across thermal management, EMI shielding, sealing, and innovation, which also includes thermal interface materials and phase change TIMs for semiconductor modules. The firm further notes that the collaboration focuses on mobility technologies such as autonomous driving, urban air mobility, and robotics, with TIMs being highlighted as critical for efficient thermal control in automotive electronic modules. Furthermore, KCC aims to expand joint development with Hyundai MOBIS and global OEMs, thereby emphasizing eco-friendly materials to support future mobility and ESG-driven innovations.

Our in-depth analysis of the thermal interface materials market includes the following segments: