Semiconductor Manufacturing Equipment Market Analysis

Equipment (Front-End Equipment, Back-End Equipment, Fab Facility Equipment)

The front-end equipment segment in the semiconductor manufacturing equipment market is anticipated to generate the largest revenue share by the end of 2037 and holds 41% share, owing to its high demand from the fabrication facilities which helps in exposing critical layers of wafers which results in reduced manufacturing costs of semiconductor devices. In addition, key players operating in the market along with some other regulatory bodies are funding the development of innovative front-end equipment.

Dimension (2D, 2.5D, 3D)

The 3D segment is set to hold 46% share of the semiconductor manufacturing equipment market through the forecasted timeframe. The primary reason for segment size expansion is the rising pressure on chipmakers to meet the surging demand for chipsets, IC manufacturers are focusing on the development of advanced chip packaging technologies such as 3D ICs. 3D dimension of semiconductors is also good at creating wafers that help the manufacturers develop memory storage devices and reduce footprint.

Our in-depth analysis of the global market includes the following segments: