Semiconductor Foundry Market Segmentation:
Technology Node Segment Analysis
The 7nm segment is anticipated to command a dominant 62.5% market share during the forecast period as it serves as the workhorse node for a broad spectrum of high-volume applications in consumer, automotive, and data center markets. While players are competing to get to 3nm and 2nm, foundries are committing to somewhat more mature nodes to enable a large customer volume. This strategy was followed up in January 2024 when UMC and Intel jointly announced the development of a 12-nanometer FinFET process platform. Through this partnership, UMC customers will be provided with a new, U.S.-based supply source for an advanced and cost-saving node, demonstrating the continued strategic importance of producing capacity below the absolute leading edge to meet the diverse needs of the market.
Wafer Size Segment Analysis
The 300mm wafer is predicted to hold around 46.4% of market share through 2035, considering it is the default standard for modern, high-volume semiconductor manufacturing. A higher surface area of the 300mm wafer compared to its 200mm version allows for more chips to be produced in each production run. Industry commitment to the 300mm standard is demonstrated by the tsunami of new fab projects being built globally. In February 2023, UMC commenced construction on its new Fab12i P3 fab in Singapore, a USD 5 billion investment to expand the company's 300mm wafer capacity for its 22/28nm processes. This project, whose manufacturing is due to commence in 2025, is a characteristic pointer that 300mm will remain the dominant wafer size for the foreseeable future, the foundation of the next generation of semiconductor manufacturing.
Our in-depth analysis of the semiconductor foundry market includes the following segments:
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