Radiation-Hardened Electronics Market Size

  • Report ID: 3314
  • Published Date: Oct 09, 2024
  • Report Format: PDF, PPT

Radiation-Hardened Electronics Market Size

Radiation Hardened Electronic Market size was valued at USD 1.72 billion in 2024 and is likely to reach USD 2.97 billion by the end of 2037, registering around 4.3% CAGR during the forecast period i.e., between 2025-2037. In the year 2025, the industry size of radiation hardened electronic is assessed at USD 1.78 billion.

The growth of the market can be attributed to the increasing demand for electronics. The rising disposable income of people across the globe, has increased the demand for electronic products. Radiation hardened electronics may become more necessary as demand for electronics rises, especially in sectors where dependability and safety are crucial. Consumers worldwide are anticipated to spend over USD 500 billion on electronic gadgets by the end of 2022.

Moreover, the growing research and development in radiation hardened electronics, is also expected to add to the market growth. There has been a growing opportunities for radiation hardened components in scientific research and development, that is further adds opportunities to the market’s growth.


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Author Credits:  Abhishek Verma


  • Report ID: 3314
  • Published Date: Oct 09, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2025, the industry size of radiation hardened electronic is assessed at USD 1.78 billion.

The radiation hardened electronic market size was valued at USD 1.72 billion in 2024 and is likely to reach USD 2.97 billion by the end of 2037, registering around 4.3% CAGR during the forecast period i.e., between 2025-2037. Growing demand of semiconductor materials, and rising demand for satellites will drive the market growth.

North America industry is estimated to dominate majority revenue share 33% by 2037, owing to growing environmental concerns in the region.

The major players in the market are Renesas Electronics Corporation, Honeywell International Inc., Xilinx, Inc., Atmel Corporation, Microchip Technology Inc., Infineon Technologies AG, BAE Systems, ST Microelectronics, Microsemi Corporation, and Texas Instruments.
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