Molded Interconnect Device (MID) Market Trends

  • Report ID: 5506
  • Published Date: Sep 16, 2025
  • Report Format: PDF, PPT

Molded Interconnect Device Market Growth Drivers and Challenges:

Growth Drivers

  • Growing technological advancements in automotive industry - The automotive sector heavily relies on MIDs for various applications, such as automotive sensors, lighting, and control systems. As per estimates, it is anticipated that the global automotive sensor industry will surpass USD 55 billion by 2025. With the rise of electric vehicles (EVs), autonomous driving technology, and the need for more compact and lightweight components, MIDs are becoming increasingly indispensable in this sector.

  • Rising trend of miniaturization products - As electronic devices continue to shrink in size while increasing in functionality, there’s a growing demand for compact, MIDs that enable the integration of multiple functionalities into smaller spaces, aligning with the miniaturization trend.

  • Evolution of consumer electronics - The demand for smaller, sleeker, and more functional consumer electric devices (smartphones, wearables, etc.) drives the need for MIDs. These devices require intricate circuitry and functional design integration, which MIDs facilitate efficiently. In total, the consumer electronics sector brought in around USD 987 billion in revenue in 2022. This propelled the MID market .
  • Innovations in medical industry - The healthcare industry leverage MIDs for various applications, including wearable medical devices, monitoring systems, and implantable devices. The need for smaller, more reliable, and customized solutions in the medical field fuels the growth of MIDs. For instance, Pacemaker makers, including Boston Scientific and Medtronic, were among the first in the medical field to adopt C-MOS technology to integrate digital and analog signals into a single-chip device. This enhanced the device's analysis and control capabilities while decreasing its size and weight. Soon, chip design methods akin to those employed in the creation of compact, lightweight, and potent consumer and military goods were applied to the design of digital medical devices, ranging from defibrillators to stethoscopes. Since then, there has been an increased trend toward shrinking processor chips, instruments, connectors, probes, and sensors built into medical equipment, propelling the market’s growth.

Challenges

  • Cost Considerations- Initial setup costs for MID production can be significant due to the specialized equipment and technology required for manufacturing. This might make MIDs less cost-competitive, especially for smaller-scale productions or in industries with stringent cost considerations.

  • Maintaining high-quality standards and reliability across batches poses a challenge in molded interconnect device manufacturing.

  • Lack of standardized protocols might hinder broader adoption, especially in industries with stringent regulatory requirements.

Base Year

2025

Forecast Period

2026-2035

CAGR

12.2%

Base Year Market Size (2025)

USD 2.2 billion

Forecast Year Market Size (2035)

USD 6.96 billion

Regional Scope

  • North America (U.S., and Canada)
  • Asia Pacific (Japan, China, India, Indonesia, Malaysia, Australia, South Korea, Rest of Asia Pacific)
  • Europe (UK, Germany, France, Italy, Spain, Russia, NORDIC, Rest of Europe)
  • Latin America (Mexico, Argentina, Brazil, Rest of Latin America)
  • Middle East and Africa (Israel, GCC North Africa, South Africa, Rest of the Middle East and Africa)

Browse key industry insights with market data tables & charts from the report:

Frequently Asked Questions (FAQ)

In the year 2026, the industry size of molded interconnect device is estimated at USD 2.44 billion.

The global molded interconnect device market size crossed USD 2.2 billion in 2025 and is likely to expand at a CAGR of over 12.2%, surpassing USD 6.96 billion revenue by 2035.

The North America molded interconnect device (mid) market is expected to capture 36% share by 2035, fueled by technological innovation and industrial advancement.

Key players in the market include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation.
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