Molded Interconnect Device Market Outlook:
Molded Interconnect Device Market size was valued at USD 2.2 billion in 2025 and is set to exceed USD 6.96 billion by 2035, expanding at over 12.2% CAGR during the forecast period i.e., between 2026-2035. In the year 2026, the industry size of molded interconnect device is estimated at USD 2.44 billion.
The market is growing as a result of the growing connection of IoT to these devices. Molded interconnect devices (MIDs) are useful in this situation. MIDs make it possible to incorporate electrical parts straight into three-dimensional forms, leading to the development of more connected and compact smart gadgets.
Designers may enhance functionality, optimize space, and construct complicated geometries with MIDs. Numerous industries, including consumer electronics, aerospace, healthcare, and automotive, are seeing a rise in the use of this technology.
In addition to this, a factor that is believed to fuel the market growth of the MID market is an increase in technological advancements in manufacturing. Continuous advancements in manufacturing technologies, such as laser direct structuring (LDS) and 3D printing, have enhanced the production efficiency and flexibility of MIDs. These techniques enable rapid prototyping and customization, catering to diverse industry needs.
