Molded Interconnect Device (MID) Market Share

  • Report ID: 5506
  • Published Date: Nov 08, 2024
  • Report Format: PDF, PPT

Molded Interconnect Device (MID) Market Share

North American Market Forecast

By 2037, North America region is expected to capture over 36% molded interconnect device market share. The industry growth in the region is also expected on account of technological innovation and industrial advancement. With a strong presence in key sectors like automotive, healthcare, aerospace, and consumer electronics, the region showcases a robust demand for sophisticated, miniaturized, and integrated electronic solutions. The automotive industry, in particular, embraces MID technology for advanced functionalities in sensors, control systems, and compact electronic components, driving innovation within the sector.

Additionally, North America’s emphasis on technological prowess and R&D investments fosters the development of cutting-edge materials and manufacturing techniques crucial for MID production. Collaborations between leading tech firms, research institutions, and manufacturers fuel the region’s market growth, contributing to the creation of versatile and high-performance solutions.

APAC Market Statistics

The molded interconnect device market Asia Pacific region will also encounter huge revenue growth during the forecast period and will hold the second position owing to the expanding automotive industry in the region. With a burgeoning demand for compact, multifunctional electronic components across diverse industries, including automotive, consumer electronics, healthcare, and telecommunications, the region witnesses significant MID adoption. Boasting robust manufacturing capabilities, countries like Japan, China, South Korea, and Taiwan spearhead MID development, leveraging advanced materials and cutting-edge manufacturing processes.

The automotive sector’s evolution towards electric and autonomous vehicles, coupled with the surge in demand for IoT devices and wearables, propel the market’s expansion. Further, collaborations between global players and local manufacturers, combined with a focus on sustainability and regulatory compliance, bolster the Asia Pacific- market’s growth trajectory, shaping it into a pivotal region for MID innovation and adoption.

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Author Credits:  Abhishek Verma


  • Report ID: 5506
  • Published Date: Nov 08, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2025, the industry size of molded interconnect device is estimated at USD 1.99 billion.

The molded interconnect device market size was valued at USD 1.82 billion in 2024 and is likely to cross USD 7.49 billion by 2037, expanding at more than 11.5% CAGR during the forecast period i.e., between 2025-2037. The market growth is due to growing connection of IoT to these devices.

North America industry is anticipated to hold largest revenue share of 36% by 2037, due to growing technological innovation and industrial advancement in the region.

The major players in the market include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation
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