Molded Interconnect Device (MID) Market Analysis

  • Report ID: 5506
  • Published Date: Nov 08, 2024
  • Report Format: PDF, PPT

Molded Interconnect Device (MID) Market Analysis

Product Type (Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems)

In molded interconnect device market, sensors segment is poised to capture over 47% share by 2037. The segment's growth can be attributed to their growing use in various industries, including automotive and industrial. The use of temperature sensors, pressure sensors, and other types of sensors is extensive in industrial applications. In total, the sensor segment garnered USD 22.4 billion in 2022. In the automotive sector, sensors are used in adaptive cruise control systems and climate control-related applications.

Moreover, the increasing use of molded interconnect devices (MIDs) in these applications drives up the demand for MID sensors during the forecast period. The integration of sensors in these sectors is improving performance, efficiency, and safety. All these factors are cumulatively responsible for the market’s growth.

Application (Telecommunications & Computing, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace)

In molded interconnect device market, telecommunications and computing segment is estimated to account for more than 34% revenue share by the end of 2037. The strong need for sophisticated electronic circuits that enable the development of 5G devices with low signal loss is attributed to the segment's growth.

Electronic businesses, such as Cicor Group, have been working to create MID gear that uses liquid crystal polymers in order to facilitate the high-frequency transmission of 5G signals. 5G had 1.1 billion subscriptions worldwide as of June 2024; 125 million more had been added in just the first quarter. Thirty-five service providers have introduced 5G standalone (SA) networks, while about 240 service providers have built 5G networks. There are more than 700 5G smartphone models available to consumers as of early 2024; this has a prospective effect on the segment’s growth.

Our in-depth analysis of the global molded interconnect device (MID) market includes the following segments:

          Product Type

  • Antennae & Connectivity Modules.
  • Sensors.
  • Connectors & Switches
  • Lighting Systems.

          Application

  • Telecommunications & Computing.
  • Consumer Electronics
  • Automotive
  • Medical
  • Industrial
  • Military & Aerospace

          Process

  • Two-shot Molding
  • Laser Direct Structuring (LDS)
Get more information on this report: Request Free Sample PDF

Browse Key Market Insights with Data Illustration:


Author Credits:  Abhishek Verma


  • Report ID: 5506
  • Published Date: Nov 08, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2025, the industry size of molded interconnect device is estimated at USD 1.99 billion.

The molded interconnect device market size was valued at USD 1.82 billion in 2024 and is likely to cross USD 7.49 billion by 2037, expanding at more than 11.5% CAGR during the forecast period i.e., between 2025-2037. The market growth is due to growing connection of IoT to these devices.

North America industry is anticipated to hold largest revenue share of 36% by 2037, due to growing technological innovation and industrial advancement in the region.

The major players in the market include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, MacDermid, Inc., Cicor Management AG, S2P Smart Plastic Product, Teprosa GmbH, DuPont, DSM Corporation
Inquiry Before Buying Request Free Sample
logo
  GET A FREE SAMPLE

FREE Sample Copy includes market overview, growth trends, statistical charts & tables, forecast estimates, and much more.

 Request Free Sample Copy

Have questions before ordering this report?

Inquiry Before Buying
Inquiry Before Buying Request Free Sample