Companies Dominating the IO-Link Landscape
- Ifm electronic GmbH
- Company Overview
- Business Strategy
- Key Technology Offerings
- Financial Performance
- Key Performance Indicators
- Risk Analysis
- Recent Development
- Regional Presence
- SWOT Analysis
- SICK AG
- Balluff GmbH
- Banner Engineering Corp.
- Siemens AG
- Rockwell Automation, Inc.
- Festo SE & Co. KG
- Datalogic S.p.A
- Hans Turck GmbH & Co. KG
- Pepperl + Fuchs
The competitive landscape of the IO-Link market is characterized by the presence of several key players offering a wide range of solutions to enhance industrial automation and connectivity. Major companies are leading the market with their advanced IO-Link masters, sensors, and connectivity devices. These companies are focused on product innovations, strategic partnerships, and acquisitions to expand their product portfolios. Additionally, emerging players are contributing to the market's growth and intensifying competition by introducing wireless IO-Link solutions and integrating IIoT capabilities.
Here are some key players operating in the global market:
Browse key industry insights with market data tables & charts from the report:
Frequently Asked Questions (FAQ)
IO-Link Market in 2025 is assessed at USD 19.3 billion.
The global market size exceeded USD 16.9 billion in 2024 and is set to expand at a CAGR of around 19.9%, surpassing USD 179.7 billion revenue by 2037.
Europe is likely hold 35% share during forecast period, driven by large number of businesses in industrial manufacturing and the rising demand for automation and IoT-connected devices.
The major players in the market include ifm electronic GmbH, SICK AG, Balluff GmbH, Banner Engineering Corp., Siemens AG, Rockwell Automation, Inc., Festo SE & Co. KG, Datalogic S.p.A, Hans Turck GmbH & Co. KG, Pepperl + Fuchs.
