Hot Melt Adhesives Market Analysis

  • Report ID: 4998
  • Published Date: Dec 24, 2025
  • Report Format: PDF, PPT

Hot Melt Adhesives Market Segmentation:

Application Segment Analysis

The packaging segment, which is part of the application, is anticipated to garner the highest share of 34.7% in the hot melt adhesives market by the end of 2035. The segment’s upliftment is highly attributed to its ability to secure products, enhance efficiency through fast settling, enabling diversified applications, such as labels, flexible packaging, and cartons, preserve freshness, and ensure sustainability with a specialized format, including biodegradable. According to an article published by the Our World in Data Organization in November 2024, 40% of the international plastic waste originates from packaging. This is worth 142 million tons per year globally, along with 84 million tons combinedly in the U.S., Europe, and China. Therefore, with an increase in waste generation, the packaging industry is continuously flourishing, which is positively impacting the market globally.

Raw Material Segment Analysis

Based on the raw material segment, the ethylene vinyl acetate (EVA) sub-segment in the market is expected to account for the second-highest share. The sub-segment’s growth is highly propelled by its versatility, cost-effectiveness, and ease of processing. EVA-based HMAs are particularly dominant in packaging, bookbinding, and woodworking applications, where fast setting times and reliable adhesion are critical. The material’s flexibility allows it to bond effectively with a wide range of substrates, including paper, cardboard, and certain plastics, making it indispensable in high-volume packaging operations. EVA adhesives also offer good thermal stability and resistance to cracking, which enhances their performance in demanding industrial environments. However, EVA’s reliance on petrochemical feedstocks exposes manufacturers to raw material price volatility, creating challenges in cost management.

Substrate Segment Analysis

By the end of the stipulated timeline, the paper and board sub-segment, part of the substrate segment, is projected to cater to the third-highest share in the hot melt adhesives. The sub-segment’s growth is highly uplifted by the packaging industry’s rapid expansion. HMAs are extensively used in case and carton sealing, labeling, and flexible packaging, where their fast-setting times and strong adhesion provide efficiency in high-speed production lines. The rise of e-commerce has further accelerated demand, as durable packaging solutions are essential for logistics and shipping. HMAs offer advantages over water-based adhesives by providing immediate bond strength, reducing downtime, and ensuring package integrity under varying environmental conditions. Additionally, their compatibility with recyclable paper and board aligns with global sustainability initiatives, particularly in Europe and North America, where regulations encourage eco-friendly packaging solutions.

Our in-depth analysis of the global market includes the following segments:

Segment

Subsegments

Application

  • Packaging
    • Food & beverage
    • E-commerce
    • Industrial
  • Nonwovens and hygiene
    • Diapers
    • Femcare
    • Medical disposables
  • Building & Construction
    • Flooring
    • Insulation
    • Woodworking
  • Automotive & Transportation
    • Interior trims
    • Lightweight bonding
  • Footwear & leather
  • Bookbinding
  • Assembly/Industrial
  • Others

Raw Material

  • Ethylene vinyl acetate (EVA)
  • Polyolefin (metallocene, APAO)
  • Styrenic block copolymers (SBC)
  • Polyurethane (PU)
  • Polyester
  • Others

Substrate

  • Paper & board
  • Plastics
    • PP
    • PE
    • PET
  • Metals
  • Wood
  • Textiles/nonwovens

End use Industry

  • Healthcare & hygiene
  • Food & beverage
  • E-commerce and logistics
  • Building & construction
    • Ethylene vinyl acetate (EVA)
    • Polyolefin (metallocene, APAO)
    • Styrenic block copolymers (SBC)
    • Polyurethane (PU)
    • Polyester
    • Others
  • Automotive
  • Consumer goods

Technology

  • Pressure-sensitive hot melts
  • Reactive polyurethane hot melts
  • Metallocene polyolefin hot melts
  • Standard thermoplastic hot melts

Product Form

  • Sticks
  • Granules/pellets
  • Blocks
  • Slugs/cartridges

Browse key industry insights with market data tables & charts from the report:

Frequently Asked Questions (FAQ)

In the year 2025, the industry size of the hot melt adhesives market was over USD 8.7 billion.

The market size for the hot melt adhesives market is projected to reach USD 14.3 billion by the end of 2035 expanding at a CAGR of 5.7% during the forecast period i.e., between 2026-2035.

The major players in the market are Beardow Adams, Paramelt B.V., Kleiberit, Tex Year Industries Inc., Nan Pao Resins Chemical Co., Ltd., and others.

In terms of the application segment, the packaging is anticipated to garner the largest market share of 34.7% by 2035 and display lucrative growth opportunities during 2026-2035.

The market in the Asia Pacific is projected to hold the largest market share of 43.2% by the end of 2035 and provide more business opportunities in the future.
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