High Density Interconnect PCB Market Size & Share, By Layers (1 Layer (1+N+1) HDI, 2 Or More Layers (2+N+2) HDI, All Layers HDI); Application - Global Supply & Demand Analysis, Growth Forecasts, Statistical Report 2025-2037

Asia Pacific Market Analysis

Asia Pacific in high density interconnect PCB market is set to account for more than 36.6% revenue share by the end of 2037, attributing to the expansion of consumer electronics manufacturing in the region. Countries including India, China, and Japan are the leading producers of consumer electronics. These electronics require high performance, offered by HDI PCBs. The continual surge in the adoption of electric vehicles has leveraged the use of HDI PCBs, to manage complex electronic systems. Manufacturers have been increasingly incorporating the HDI technology to meet the high-performance requirements of the modern-day automotive.

The high density interconnect PCB market in China is projected to experience robust growth during the forecast period owing to the autonomous driving technology. It is essential to adopt the HDI PCBs for handling multiple sophisticated circuits in the automotive application. Manufacturers are utilizing HDI technology to address high density needs in automotive electronic devices. Strategic collaborations and partnerships among key players in the high density interconnect PCB market is expected to accelerate market growth in the country. For instance, DuPont signed for a strategic cooperation with Zhen Ding Technology Group in October 2024 to advance high-end PCB technology. The collaboration is aimed at enhancing the material performance and promoting sustainable development in the electronics sector.

In India, the high density interconnect PCB industry is anticipated to expand at a robust CAGR throughout the forecast period. This growth can be attributed to the rising need for technologically complex electronics needed in the automotive, telecommunication, and consumer electronics industries. The Government of India with the advent of the Make in India initiative has encouraged production locally. The demand is focused on HDI PCBs with a special emphasis on EVs and healthcare devices, which occupy a considerable amount of high-end capacity. Smartphone ownership and 5G network installation are also driving the high density interconnect (HDI) PCB market for miniaturized, high reliable PCBs. India has also seen some key alliances made to increase capacity. For instance, in October 2024, Amber Enterprises invested in a joint venture with Korea Circuit for HDI and Flexible PCB manufacturing in order to promote Aatmanirbhar Bharat. The partnership is aimed at meeting the local needs as well as to minimize the importation of the same product.

North America Market

The high density interconnect PCB market in North America is expected to be driven by strong electronics manufacturing industry, due to the enhancements in automotive, aerospace, and telecommunication industries. The rising interest in new technologies and research and development spending will help drive the adoption of HDI PCBs for high-performance applications in the region. The high density interconnect PCB market is steadily growing attributed to the expansion of 5G networks and IoT devices. The U.S. giants are leveraging these trends to enhance their HDI production capabilities. The merger, which includes the acquisition of Sunstone Circuits by American Standard Circuits in July 2023, clearly depicts the market’s tendency to establish a consolidated and improved supply chain as well as product range.

The U.S. high density interconnect PCB market is increasing, primarily due to the advanced technological growth within the country and focus on high reliability circuits in various industries. An increase in the usage of electrical vehicles has also resulted in the increased demand for HDI PCBs due to its size and superior performance. Strategic acquisitions have defined the evolution of the U.S. HDI PCB market. For instance, in 2023, Firan Technology Group acquired the IMI Inc. to expand its capacity to deliver RF circuit boards for aerospace and defense industry. This acquisition is in line with increasing needs for developing miniaturized electronics and components specifically for sensitive and stringent applications.

The high density interconnect PCB market in Canada is growing, attributed to the rising focus on advancement of manufacturing and innovation. The increasing acceptance of the IoT devices and the growing production of electric vehicles also increase the need for advanced PCB materials in the country. Canada also benefits from a skilled workforce and strong research institutions, fostering innovation in HDI PCB design and manufacturing. Companies are forming strategic partnerships and investing in advanced technologies, ensuring the continued growth of Canada’s HDI PCB market. Canada also benefits from the advantages of a skilled workforce and research institutions to support the innovation in the development of high-definition interconnect PCB design as well as high end manufacturing. Companies in Canada are entering into strategic partnerships, and are deploying latest technologies, which is making Canada’s market for HDI PCB to grow in future.