Flip Chip Market Analysis

Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead-Free Solder, Gold Stud Bumping)

In flip chip market, copper pillar segment is likely to hold more than 40% share by 2037. The primary factors driving the demand for copper pillar bumping technology are its superior longevity, convenient availability, good circuit performance, and cheaper cost as compared to alternative bumping technologies.

Additionally, it is believed that the benefits of this technology-such as less bump pitch and the ability to maintain standoff with less pitch will present prospects for market expansion shortly. Furthermore, the growing demand for tablets is also estimated to boost the segment growth. In 2023, almost 127 million tablets were supplied globally, in the last quarter of the year, shipments topped over 35 million devices.

Packaging Technology (2D IC, 2.5D IC, 3D IC)

In flip chip market, 2.5D IC segment is predicted to account for more than 50% revenue share by the end of 2037. In the 2.5D IC packaging technique, a silicon interposer substrate (passive or active) is inserted between the SiP substrate and the dice, enabling considerably finer die-to-die connections that boost efficiency and lower power expenses.

International adoption of 2.5D IC flip chips is primarily driven by its reduced size in comparison to other packaging technologies, improved performance, increased capacity to pack more chips, and higher efficiency.

Our in-depth analysis of the global market includes the following segments: