Flip Chip Market Analysis

  • Report ID: 5690
  • Published Date: Dec 06, 2024
  • Report Format: PDF, PPT

Flip Chip Market Analysis

Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead-Free Solder, Gold Stud Bumping)

In flip chip market, copper pillar segment is likely to hold more than 40% share by 2037. The primary factors driving the demand for copper pillar bumping technology are its superior longevity, convenient availability, good circuit performance, and cheaper cost as compared to alternative bumping technologies.

Additionally, it is believed that the benefits of this technology-such as less bump pitch and the ability to maintain standoff with less pitch will present prospects for market expansion shortly. Furthermore, the growing demand for tablets is also estimated to boost the segment growth. In 2023, almost 127 million tablets were supplied globally, in the last quarter of the year, shipments topped over 35 million devices.

Packaging Technology (2D IC, 2.5D IC, 3D IC)

In flip chip market, 2.5D IC segment is predicted to account for more than 50% revenue share by the end of 2037. In the 2.5D IC packaging technique, a silicon interposer substrate (passive or active) is inserted between the SiP substrate and the dice, enabling considerably finer die-to-die connections that boost efficiency and lower power expenses.

International adoption of 2.5D IC flip chips is primarily driven by its reduced size in comparison to other packaging technologies, improved performance, increased capacity to pack more chips, and higher efficiency.

Our in-depth analysis of the global market includes the following segments:

          Wafer Bumping Process

  • Copper Pillar
  • Tin-Lead Eutectic Solder
  • Lead Free Solder
  • Gold Stud Bumping

          Packaging Technology

  • 2D IC
  • 2.5D IC
  • 3D IC

          Product

  • Memory
  • LED
  • CMOS Image Sensor
  • CPU
  • SoC
  • GPU

          Packaging Type

  • FC BGA
  • FC PGA
  • FC LGA
  • FC QFN
  • FC SiP
  • FC CSP

          Application

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Industrial Sector
  • Medical Devices
  • Smart Technologies
  • Military & Aerospace
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Browse Key Market Insights with Data Illustration:


Author Credits:  Abhishek Verma


  • Report ID: 5690
  • Published Date: Dec 06, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2025, the industry size of logistics robots is estimated at USD 35.86 billion.

The flip chip market size was over USD 33.91 billion in 2024 and is anticipated to cross USD 83.73 billion by 2037, witnessing more than 7.2% CAGR during the forecast period i.e., between 2025-2037. There has been a rising need to reduce the power consumption which is expected to be achieved through flip chips.

Asia Pacific industry is estimated to account for largest revenue share of 33% by 2037, due to rising substantial need for semiconductors in the region.

The major players in the market are Amkor Technology, Phison Electronics, IBM Corporation, 3M, ASE Technology Holding Co., Ltd., Advanced Micro Devices, Inc., APPLE INC., Powertech Technology Inc., Stats ChipPAC Ltd, NepesPte Ltd
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