Electrostatic Discharge Packaging Market Trends

Growth Drivers

• Growing demand in electronics industry - The majority of electrical goods usually sustain damage as a result of static electricity buildup. The electrostatic discharge packaging market is further driven by the growing use of ESD packaging for ESD-prone components in the electrical and electronics industry, a trend that is anticipated to persist throughout the forecast period.
  
  For instance, the line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics, and other sensitive electronic components has been expanded by Cleanroom Film and Bags (CFB), a division of C-P Flexible Packaging.
   
• Growing adoption in printed circuit boards - Electrostatic discharge has the ability to ruin any printed circuit board. The electrostatic discharge (ESD) packaging market is anticipated to be driven throughout the projected period by the growing usage of these packages by different end-use industries.
  
  Additionally, the product is shielded from gasses and combustible materials by the ESD packing. These types of packaging materials are designed to encourage the straight flow of electricity without endangering the goods that are within. Since ESD packaging provides greater safety than conventional packaging techniques, the market is anticipated to grow throughout the projected period.
   
• Surge in the demand for biodegradable ESD packages - It is anticipated that the worldwide ESD packaging market will see more investment possibilities as a result of most companies' increased efforts in biodegradable packages. Although biodegradable packaging is less expensive and weighs less, it will take some time for the electrostatic discharge packaging market to accept these relatively new and experimental products.
  
  Also, the growing plastic pollution is one of the major elements that will increase the demand for biodegradable packaging. According to the National Institutes of Health, plastic manufacturing has grown from 2.3 million tons in 1950 to over 450 million tons in 2015, and by 2050, it is predicted to have doubled.

Challenges

• High raw material prices - To satisfy strict criteria, ESD packaging solutions may call for specialized materials and production techniques. These materials' and processes' costs might be problematic, particularly for businesses where costs are a factor. There is a dearth of standardized ESD packaging solutions since different sectors have different requirements for ESD protection.
   
• Compatibility issues with ESD packaging - When components from several manufacturers must be packaged together, compatibility problems may occur. Although shielding sensitive devices with ESD packaging is crucial, eco-friendly and sustainable procedures are becoming more and more important. As a result, the hazards and expensive cost of electrostatic discharge packaging may reduce acceptance rates, which would further impede electrostatic discharge packaging market expansion.