Electrostatic Discharge Packaging Market Outlook:
Electrostatic Discharge Packaging Market size was over USD 3.35 billion in 2025 and is projected to reach USD 5.89 billion by 2035, growing at around 5.8% CAGR during the forecast period i.e., between 2026-2035. In the year 2026, the industry size of electrostatic discharge packaging is evaluated at USD 3.52 billion.
The electrostatic discharge (ESD) packaging market is on the rise due to the increased use of better protection methods in electronics, semiconductors, and the automotive industry. Since complex electronic devices and components have become more and more sensitive, the protection of ESD packaging, which avoids the effect of static electricity has become essential. In July 2024, Daubert Cromwell launched VCI/ESD poly film and bags that combine the corrosion protection feature with the static shield. This two-in-one packaging satisfies the new electrostatic discharge packaging market requirements and is indicative of a shift toward multiple-layer protection solutions in electronics production and distribution.
Increased government support to improve electronics manufacturing and increase semiconductor production also promotes the ESD packaging market. The U.S. CHIPS and Science Act and similar initiatives in Asia Pacific and Europe create demand for semiconductor fabrication, which increases the need for ESD-safe materials. In November 2024, EcoCortec introduced EcoSonic VpCI-125 PCR HP Films and Bags, which are aligned with sustainability including the use of 30% post-consumer recycled material. This innovation is inline with sustainable development goals and government policies on green packaging solutions to support ESD packaging to advocate for sustainable supply chains.
