Electrostatic Discharge Packaging Market Analysis

Material Type (Conductive Plastics, Metal, Static Dissipative Plastics, Polyethylene (PE), Polypropylene (PP), Polyvinyl Chloride (PVC))

Conductive plastics segment in the electrostatic discharge packaging market is poised to reach USD 620 Million by 2036. The segment growth can be credited to the growing usage of ESD packaging in the electronic industry. Electrostatic discharge is effectively dissipated by conductive plastics and coatings, which provide a direct conductive channel for static charges.

These materials provide consistent ESD protection because of their predicted surface resistance level. Sensitive electronic components can be shielded from external ESD threats with exceptional ESD shielding efficacy from metal foil and metalized films.

Packaging Type (Chipboard Boxes, Corrugated Boxes, Tote Boxes, Tubes and Clamshells)

Chipboard boxes segment in the electrostatic discharge packaging market is set to register more than 5.3% growth from 2024 to 2036. The segment growth can be attributed to the growing demand for cost-effective packaging. According to the World Packaging Organization, the cost of packaging accounts for 48 cents of every dollar (48%) spent on Coke's products. Primary containers and flexible packaging, or the wrappers and containers that provide instant protection to the packaged product, account for 60% of the market. Because they are affordable and lightweight, chipboard boxes are perfect for shipping and storing tiny, light-weight electronic components. Their little weight makes them appropriate for sectors that need economical packaging solutions and lowers shipping expenses.

End-use (Electronics and Semiconductors, Automotive, Aerospace and Defense, Healthcare, Industrial Machinery, Consumer Goods)

Electronics & semiconductors segment is predicted to hold ESD packaging market share of more than 32% by 2036. The segment growth is impelled by the growing use of ESD packaging in the electronic industry to protect the components from electrostatic damage. The electronics manufacturing industry deals with a wide range of ESD-sensitive components, such as integrated circuits, microprocessors, and printed circuit boards. ESD packaging is crucial to protect these components during assembly, testing, and transportation.

Our in-depth analysis of the global market includes the following segments:

Material Type	Conductive Plastics Metal Static Dissipative Plastics Polyethylene (PE) Polypropylene (PP) Polyvinyl Chloride (PVC)
Product Type	Bags and Pouches Trays Boxes and Containers Tapes and Labels Foams
Packaging Type	Chipboard Boxes Corrugated Boxes Tote Boxes Tubes and Clamshells
ESD Classification	Anti-Static Static Dissipative Conductive
Application	Integrated Circuits Printed Circuit Boards (PCBs) Electronic Components Medical Devices Automotive Parts Aerospace Components Chemicals and Explosives
End-use	Electronics and Semiconductors Automotive Aerospace and Defense Healthcare Industrial Machinery Consumer Goods

Frequently Asked Questions (FAQ)

In the year 2023, the industry size of electrostatic discharge packaging was over USD 2 billion.

The market size for electrostatic discharge packaging is projected to cross USD 5.3 billion by the end of 2036 expanding at a CAGR of 6% during the forecast period i.e., between 2024-2036.

The major players in the market are Sealed Air Corporation, Desco Indutries Inc., Pall Corporation, Teknis Limited, RS Technologies, LLC, Statclean Technology (M) Sdn Bhd, Cortec Corporation, Protective Packaging Corporation, Dou Yee Enterprises (S) Pte Ltd, Tek Pak, Inc., and others.

The conductive plastics segment is anticipated to garner a size of 620 million during 2024-2036.

The North America electrostatic discharge packaging sector is poised to generate a revenue of 560 million by the end of 2036.

Electrostatic Discharge Packaging Market Analysis