Electrostatic Discharge Packaging Market Segmentation:
Material Type Segment Analysis
Conductive materials segment is poised to account for ESD packaging market share of around 36.4% by 2035. The segment is observing rapid growth as the materials are very useful in protecting electronics from the accumulation of static charges and our ability to protect parts throughout transit and storage. In July 2024, Daubert Cromwell’s VCI/ESD poly film and bags established a new level of conductive material through the integration of corrosion inhibitors and ESD features. Furthermore, the segment’s growth is driven by the rising manufacture of semiconductors as well as the broadening usage in industries that need the protection of sensitive components.
Application Segment Analysis
In ESD packaging market, electronics manufacturing segment is estimated to capture revenue share of over 44.7% by 2035. As consumer electronics, telecommunications, and IoT devices become more popular, it becomes necessary to protect fragile components. In June 2024, Siemens launched new ESD verification tools targeting semiconductor manufacturing that prove that static control is crucial in electronics. The electronics segment continues to grow at a significant pace due to increased digitalization and connectivity, dominating the ESD packaging market.
Our in-depth analysis of the global market includes the following segments:
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