Electronic Board Level Underfill and Encapsulation Material Market Segmentation:
Material Type (Quartz/Silicone, Alumina Based, Epoxy Based, Urethane Based, Acrylic Based)
In terms of material type, epoxy polymer segment in the electronic board level underfill and encapsulation material market is anticipated to hold the highest CAGR by the end of 2035. Epoxy polymer-based underfill increases product reliability and provides excellent adhesion to a variety of substrates. In addition, these underfills have excellent resistance to various mechanical and thermal shocks, allowing electronic products to function normally even under large fluctuations in ambient temperature. These diverse properties have led to the increasing use of epoxy polymer-based electronic circuit board-level underfills in the market.
Board Type (CSP, BGA, Flip Chips)
Based on board type, the flip chip segment is set to dominate the electronic board level underfill and encapsulation material market with a share of 40% during the projected period. Electronic circuit board level underfill and encapsulation material is widely used in flip chip applications, where underfill increases the durability of flip chip assemblies and increases the reliability of both electrical connections and physical contact. Rising demand for miniaturization of electronic devices has led to an increase in flip-chip applications and is expected to drive market growth during the estimated period. For example, according to his August 2021 issue of the Journal of the American Society of Mechanical Engineers, with the rapid development of the microelectronics industry, flip-chip applications are widely used in microelectronic packages and devices.
Our in-depth analysis of the global electronic board level underfill and encapsulation material market includes the following segments:
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