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Electronic Board Level Underfill and Encapsulation Material Market - Top Companies and Manufacturers

  • Report ID: 5595
  • Published Date: Oct 22, 2024
  • Report Format: PDF, PPT

Companies Dominating the Electronic Board Level Underfill and Encapsulation Material Landscape

    • Protavic America
      • Company Overview
      • Business Strategy
      • Key Product Offerings
      • Financial Performance
      • Key Performance Indicators
      • Risk Analysis
      • Recent Development
      • Regional Presence
      • SWOT Analysis
    • Henkel
    • Namics AI Technology, Inc
    • H.B. Fuller
    • Showa Denko Materials Co., Ltd.
    • Zymet
    • MacDermid Alpha
    • Epoxy Technology Inc
    • Lord Corporation
    • Dymax Corporation
Browse Key Market Insights with Data Illustration:

In the News

  • MacDermid Alpha stated in December 2021 that it will showcase its underfill solutions from the ALPHA HiTech portfolio at the IPC APEX EXPO in California. MacDermid Alpha will be able to increase the market share of its underfill products portfolio thanks to these advancements.
  • Dymax Corporation unveiled Multi Cure -9037-F, an encapsulation for printed circuit board assembly, in June 2020.

Author Credits:  Rajrani Baghel


  • Report ID: 5595
  • Published Date: Oct 22, 2024
  • Report Format: PDF, PPT

Frequently Asked Questions (FAQ)

In the year 2025, the industry size of electronic board level underfill and encapsulation material is assessed at USD 358.63 million.

Electronic Board Level Underfill and Encapsulation Material Market size was valued at USD 344.31 million in 2024 and is likely to reach USD 665.51 million by the end of 2037, expanding at around 5.2% CAGR during the forecast period i.e., between 2025-2037. The growing demand for laptop and increasing penetration of smartphones will drive the market growth.

Asia Pacific industry is estimated to hold largest revenue share of 33% by 2037, due to rising substantial growth in the electronics sector in the region.

The major players in the market are of Showa Denko Materials Co., Ltd., Zymet, MacDermid Alpha, Epoxy Technology Inc, Lord Corporation, Dymax Corporation, and others.
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