Electrically Conductive Adhesives Market size was over USD 12.09 Billion in 2023 and is set to cross USD 41.24 Billion by the end of 2036, growing at more than 9.9% CAGR during the forecast period i.e., between 2024-2036. In the year 2024, the industry size of electrically conductive adhesives is estimated at USD 13.17 Billion. The electronics industry uses electrically conductive adhesives. They offer several advantages over traditional soldering or mechanical fastening methods, such as lower processing temperatures, compatibility with heat-sensitive components, and improved durability. For instance, in electronics, they are used for bonding surface-mount devices, attaching heat sinks, connecting flex circuits, and sealing electronic components.
Electrically conductive adhesives are designed to provide a strong bond between components or substrates while also allowing the flow of electricity. Hence, these adhesives find applications in medical electrodes, biosensors, and implantable devices.
Growth Drivers
Challenges
Base Year |
2023 |
Forecast Year |
2024-2036 |
CAGR |
9.9% |
Base Year Market Size (2023) |
USD 12.09 Billion |
Forecast Year Market Size (2036) |
USD 41.24 Billion |
Regional Scope |
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Form (Paste Adhesives, Film Adhesives)
The film adhesives segment is garnering the largest gain in the electrically conductive adhesives market. Film adhesives offer convenient handling and precise application owing to their pre-cut form. This feature simplifies the assembly process, reduces material waste, and enhances production efficiency, leading to potential cost savings for manufacturers. A study reported a 20% reduction in assembly time and a 15% decrease in rework rates when using film adhesives compared to other forms. Film adhesives are well-suited for miniaturized electronic devices due to their thin and uniform structure. The trend towards smaller and more compact electronic devices drives the demand for film adhesives, which enable effective bonding while minimizing added weight or bulkiness.
End Use Industry (Electronics, Automotive, Aerospace, Medical Devices)
The automotive segment is attributed to a significant share in the year 2036. The growth of the segment can be accredited to the increasing electrification of vehicles. The shift towards electric vehicles (EVs) and hybrid electric vehicles (HEVs) drives the demand for electrically conductive adhesives in the automotive sector. These adhesives play a crucial role in bonding and connecting electrical components, such as batteries, power electronics, electric motors, and charging systems, within electric and hybrid vehicles. Automakers are increasingly focused on reducing the weight of vehicles to improve fuel efficiency and reduce emissions.
Our in-depth analysis of the global market includes the following segments:
Form |
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End Use Industry |
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APAC Market Statistics
The electrically conductive adhesives market in the Asia Pacific region is slated to hold the largest market share by the end of 2036. This growth is owing to the increasing investments in renewable energy. APAC countries are actively investing in renewable energy sources, such as solar and wind power. Electrically conductive adhesives play a vital role in the assembly and interconnection of components in renewable energy systems, including solar panels and wind turbines. The region's focus on renewable energy contributes to the demand for these adhesives in APAC.
North American Market Forecast
The electrically conductive adhesives market in the North American region is projected to account for substantial growth. The growth is ascribed to the strong electronics and semiconductor industry. North America has a well-established electronics and semiconductor industry. The region is home to prominent electronics manufacturers, semiconductor companies, and research institutions. North America is home to several prominent companies in the electronics and semiconductor industry, including Intel Corporation, Qualcomm Incorporated, Texas Instruments Incorporated, Micron Technology Inc., Apple Inc., and many others.
Author Credits: Rajrani Baghel
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