Automated Optical Inspection Market Trends

Growth Drivers

• Growing Demand for Fast Printed Circuit Boards- The modern world demands that both people and technology move quickly because it moves so quickly. This anticipates things to become faster as time goes on, and electronics is no exception. The PCB technology will need to change for the gadgets to meet the increasing demand for speed in the form of flexible printed circuit board. Because they require more complexity during the design process, high-speed PCBs present a particular challenge for designers. On a high-speed PCB, the circuit layout has an impact on the signal integrity. Circuit boards (PCBs) are the fundamental components of almost everything electronic. Over 625 million square feet of printed circuit boards were produced in Taiwan in 2022. Taiwan was a significant manufacturer of electronic parts.
• The Surging Process of Miniaturization of Printed Circuit Boards and Electrical Components- Any product's manufacturing requires automated optical inspection equipment, but printed circuit boards and other small items require them even more. An automated optical inspection system uses image processing and artificial intelligence-based software to find defects in any manufactured good. Printed circuit boards with high-density interconnect (HDI), which are more detailed and densely packed with components, are gaining popularity. The usage of compact, portable structured devices has increased, which is the cause of this. Because it is challenging to perform human printed circuit board examinations, automated optical inspection are being employed more and more. The increasingly compact and intricate printed circuit boards are driving the development of automated optical inspection devices.
• Increasing Requirement for AOI Systems to Examine IC Substrates- The advent of nanotechnology has led to the reduction in size and application of high-density printed circuit boards in the electronics industry. However, a lot of issues are emerging as a result of these developments. Several PCB problems arise from the ball grid array (BGA) gap contracting in tandem with the PCB's diminishing size. Substrate corrosion, material mismatch, solder paste problems, and EMI interference susceptibility are a few of these flaws. A manual examination is not able to accurately identify these flaws. As a result, the need for using AOI devices to find IC substrate flaws is growing.

Challenges

• False call rate of AOI systems based on images- The number of functioning components that are discovered to be defective is known as the false call rate (FCR), and the false call rate is measured in parts-per-million (ppm). The most important consideration for image-based AOI systems is false calls. Several images are used by the image-based AOI system to distinguish between good and defective components. Nevertheless, the operator who takes these pictures and enters them into the database is primarily responsible for this system. It is occasionally possible for incorrectly identified photographs to be added to the image database, rendering parameter optimization unfeasible.
• Superior inspection technology is available as a stand-in which may impede the automated optical inspection market growth.
• Growth of the market may be hampered by maintaining cost-effectiveness in fiercely competitive markets.